i-BRAIN – Institute for Brain Research Advanced Interfaces and Neurotechnologies - is a highly-interdisciplinary research institute focused on developing transformative brain-computer interfaces (BCIs) that blur the distinction between electronics and the brain. Founded by world-renowned scientist Prof. Charles Lieber, i-BRAIN will enable groundbreaking research to understand the brain and brain diseases as well as breakthrough technologies for treatment of neurological and neurodegenerative diseases for the near-term but also enable future advances and treatments that today may be considered the realm of science fiction. Additionally, i-BRAIN will instill a positive and highly interdisciplinary culture in the training of young scientists, engineers and doctors such that they are prepared to lead the development of science and engineering as well as the translation of ideas into commercial technologies that benefit present and future generations!

1. PCB & Neural Interface Engineer

Core Responsibilities

1. Hands-on PCB Design & Fabrication: Lead the end-to-end design of printed circuit boards (PCBs) tailored for IC chips, handle mixed digital/analog signal routing, including impedance-controlled routing where appropriate. Implement strict signal integrity (SI), power integrity (PI), grounding, and shielding techniques vital for microvolt-level neural signal isolation.

2. Fabrication & Assembly Oversight: Coordinate directly with external PCB foundries and assembly vendors. Oversee fabrication quality, manage component sourcing/BOMs, and assembly process control. Ensure compliance with defined validation procedures, yield targets, and quality standards.

3. System Testing & Bring-up: Perform rigorous board bring-up, hardware debugging, chip characterization to identify root causes and implement corrective actions. Validate system performance using oscilloscopes, logic analyzers, and custom test benches to ensure reliable data I/O routing.

4. Next-Gen System Support: Work closely with the research team to address immediate interface and hardware integration challenges, especially preparing for incoming future high-channel-count neural interface systems.

5. General Electronics Troubleshooting: Serve as the go-to technical expert for day-to-day lab electronics issues. Rapidly diagnose and resolve computer interface issues, data acquisition (DAQ) bottlenecks, and general hardware routing problems.

核心职责

1. PCB 设计与制板实操：负责面向IC 芯片的PCB 全流程设计，包括数模混合信号布线（含阻抗控制布线），并严格执行信号完整性、电源完整性、接地及屏蔽设计，保障微伏级神经信号隔离；

2. 制板与组装监督：与外部PCB 厂及组装厂商直接对接，监督制造质量、物料采购/BOM管理及组装工艺控制；确保符合既定的验证流程、良率目标及质量标准；

3. 系统测试与启动：执行严格的板级上电、硬件调试及芯片特性分析，定位根本原因并实施纠正措施；使用示波器、逻辑分析仪及定制测试台验证系统性能，确保数据I/O路径的可靠传输；

4. 下一代系统支持：与研究团队紧密协作，解决当前接口与硬件集成的实际挑战，特别为未来即将引入的高通道神经接口系统做好技术准备；

5. 通用电子故障排查：担任实验室日常电子问题的技术专家，快速诊断并解决计算机接口、数据采集（DAQ）瓶颈及通用硬件路由问题。

Qualifications & Requirements

1. BS or MS degree in Electrical Engineering or related field.

2. Strong practical experience in PCB schematic design and layout for mixed-signal systems (e.g., using Altium Designer, Cadence Allegro, KiCad or similar tools).

3. Experience with PCB fabrication processes, assembly workflows, and vendor coordination.

4. Experience with board bring-up, debugging, and testing of IC-based electronic systems.

5. Experience with characterizing signal behavior across board traces, cables, connectors, and data I/O paths, such as high-speed differential-pair waveforms, eye-diagram measurements, signal integrity, timing analysis, and robust systemlevel data routing.

6. Deep understanding of analog/digital signal routing, impedance matching, grounding strategies, and EMI/noise reduction techniques.

7. Experience with CMOS IC interfacing and high-density I/O systems is strongly preferred.

8. Familiarity with oscilloscopes, logic analyzers, and general electronic debugging tools.

9. Experience with FPGA, DAQ systems, or high-speed interfaces is a plus.

10.Strong hands-on problem-solving skills and willingness to work closely with experimental researchers.

11. Ability to work full time in a collaborative interdisciplinary environment.

任职要求

1. 电子工程或相关专业学士或硕士学位；

2. 具备扎实的混合信号系统PCB 原理图设计及版图布局实践经验（使用AltiumDesigner、Cadence Allegro、KiCad 或类似工具）；

3. 熟悉PCB 制程、组装流程及外协厂商协调工作；

4. 具有基于IC 的电子系统的板级上电、调试及测试经验；

5. 具备板级走线、线缆、连接器及数据I/O 通路上的信号特性分析经验，例如高速差分对波形、眼图测量、信号完整性、时序分析以及系统级数据路由的可靠性验证；

6. 具备对模拟/数字信号布线、阻抗匹配、接地策略及EMI/噪声抑制技术的深入理解；

7. 熟悉示波器、逻辑分析仪及常用电子调试工具；

8. 具备扎实的动手解决问题能力，并乐于与实验研究人员密切协作；

9. 能够在多学科协作环境中全职工作；

10. 有CMOS IC 接口及高密度I/O 系统经验者优先；

11. 有FPGA、DAQ 系统或高速接口经验者优先。

2. Associate/Assistant Investigators

Core Responsibilities:

1. Conduct independent research under the supervision of the Principal Investigator (PI) of the research group.

2. Lead nonhuman primate (NHP) research efforts focused on implementation of novel electrophysiological prob.e technologies within the context of cognitive and motor disease models.

3. Assist with rodent research efforts focused on implementation of novel electrophysiological probe technologies for model studies and treatments of neurodegenerative disease and stroke.

4. Assist in academic manuscript preparation.

5. Mentor postdoctoral researchers, students, and research assistants.

6. Independently or collaboratively assist the PI in applying for research grants.

7. Support lab management tasks.

Qualifications & Requirements:

1. Ph.D. and/or postdoctoral research experience from a leading research institution or university.

2. Strong background in neuroscience or related field with demonstrated independent research capabilities and extensive experimental experience.

3. Experience with NHP surgery, neural probe implantation, as well as cognitive and related studies.

4. Experience with rodent disease models, electrophysiology and histology.

5. Proven track record of high-quality publications as the first or corresponding author.

6. Proficient in English for academic communication.

7. Strong passion for exploring new research directions.

8. Excellent communication, teamwork skills, and academic integrity.

3. Research Assistants 

Core Responsibilities:

1. Assist Associate/Assistant Investigators, postdoctoral fellows and graduate students with research activities. 

2. Conduct research under the supervision of the PI.

3. Support daily laboratory operations and management.

Qualifications & Requirements:

1. A Bachelor’s or Master’s degree in a relevant field, such as biology, chemistry, physics, neuroscience, applied physics, data science, bioengineering, chemical engineering, computer science, electrical engineering, materials science, neurology, or regenerative medicine.

2. Proficiency in English for effective communication.

3. Strong passion for exploring new research directions.

4. Excellent communication skills, teamwork abilities, and academic integrity.

4. CMOS-IC MEA Design Lead

Core Responsibilities:

1. Lead architecture and design of high-channel-count CMOS MEA recording and stimulation chips.

2. Define long-term IC architecture, technology roadmaps, and scalability strategies for next-generation neural interfaces

3. Design low-noise, low-power analog front ends for neural recording.

4. Define scalable readout architectures for ultra-high channel-count systems.

5. Coordinate IC design decisions with system-level constraints including signal integrity, power, bandwidth, and thermal limits.

6. Lead full IC development cycles, including schematic design, layout oversight, verification, tape-out, and foundry engagement.

Qualifications & Requirements:

1. MS or PhD in Electrical Engineering, Microelectronics, or related field.

2. Strong background in analog and mixed-signal IC design.

3. Experience with large-scale ADCs, on-chip signal processing, and large-scale sensor interfaces.

4. Multiple successful silicon tape-outs with demonstrated ownership of key blocks or full-chip architecture.

5. Ability to work full time and closely with an interdisciplinary team.

5. Backend & System Architect

Core Responsibilities:

1. Define and develop backend electronics and system-level architecture for large-scale neural recording systems.

2. Design data acquisition, synchronization, and high-speed data transport systems.

3. Lead system bring-up, debugging, and performance validation.

4. Coordinate integration across chip, board, and system levels.

5. Work with external vendors on PCB fabrication, assembly, and testing.

Qualifications & Requirements:

1. MS or PhD in Electrical Engineering or related field.

2. Strong experience with designing and delivering complex backend electronics or data acquisition systems

3. Familiarity with high-speed interfaces, clocking, and synchronization.

4. Experience with FPGA or SoC-based systems is a plus.

5. Ability to work full time and drive system-level execution and end-to-end delivery.

请提供以下材料：

1. 个人简历（CV）。

2. 其他可证明个人能力的相关材料。

请将上述材料以PDF格式，连同申请人的自我介绍，发送至对应岗位的接收邮箱（邮件主题格式：姓名 + 应聘岗位）。

各岗位对应接收邮箱如下：

- 副研究员/助理研究员（Associate/Assistant Investigators）、研究助理（Research Assistants）：ibrain@smart.org.cn

- CMOS-IC微电极阵列设计负责人（CMOS-IC MEA Design Lead）、后端及系统架构师（Backend & System Architect）、PCB与神经接口工程师（PCB & Neural Interface Engineer）：zhangxiaohang@smart.org.cn